CapStrate® Bulk Capacitance Embedded in a High-k Ceramic Substrate
Design Guide
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- One-stop design, manufacturing, and assembly
Choosing the correct CapStrate® influences the mechanical and electrical function of a design. Johanson Dielectrics offers ceramic substrates for use in application specific environments. It is recommended to choose the right substrate that meets the required electrical requirements and is suitable for the environment the product will operate in.
Johanson Dielectrics offers a variety of materials with a high dielectric constant (K) that can be used within CapStrate® designs. The dielectric constant is directly related to the amount of bulk capacitance that can be realized and allows for compact form factors.
Table 1: Available CapStrate® & Electrical Properties
CapStrate® Material | X7R | NP0 | X8R |
---|---|---|---|
Dissipation Factor | <2.5% | <0.15% | <2.5% |
Dielectric Strength (V/mil) | 200 | 300 | 200 |
Temperature Coefficient | ±15% | 0 ± 30 ppm/°C | ±15% |
Temperature Range | -55 °C to +125 °C | -55 °C to +125 °C | -55 °C to +150 °C |
CapStrate® Sizes & Shapes
Table 2: Rectangular Dimensions (CapStrate®)
Dimension | Minimum | Maximum | Tolerance |
---|---|---|---|
Thickness | 0.050” (1.27mm) | 0.215” (5.461mm) | +/- 0.005 (0.127mm) |
Length | 0.20” (5.08mm) | 2.00”/1.00” (50.8/25.4mm) | +/- 0.005 (0.127mm) |
Width | 0.20” (5.08mm) | 1.00”/2.00” (25.4/50.8mm) | +/- 0.005 (0.127mm) |
Temperature Range | -55 °C to +125 °C | -55 °C to +125 °C | -55 °C to +150 °C |
Table 3: Circular Dimensions (CapStrate®)
Dimension | Minimum | Maximum | Tolerance |
---|---|---|---|
Thickness | 0.050” (1.27mm) | 0.215” (5.46mm) | +/- 0.005 (0.127mm) |
Diameter | 0.20” (5.08mm) | 2.00” (50.8mm) | +/- 0.005 (0.127mm) |
The advantages of CapStrate® Dielectrics can be fully realized by replacing discrete capacitors with bulk capacitance from the ceramic substrates. The amount of capacitance that can be utilized varies depending on the design dimensions.
Tables 4 and 5 reference the maximum amount of capacitance that can be designed for dimensional, substrate and voltage constraints.
Typical voltage ratings vary from 100 to 1000V, however, engineers are invited to discuss special voltage requirements not listed below.
Table 4: Rectangular Bulk Capacitance (CapStrate®)
NP0 | Length | Width | Thickness | 100V | 250V | 500V | 1000V |
---|---|---|---|---|---|---|---|
Maximum Size | 2.00” (50.8mm) | 1.00” (25.4mm) | 0.150” (3.81mm) | 5000nF | 2500nF | 1400nF | 940nF |
Minimum Size | 0.20” (5.08mm) | 0.20” (5.08mm) | 0.050” (1.27mm) | 30nF | 9nF | 5nF | 2.8nF |
X7R | Length | Width | Thickness | 100V | 250V | 500V | 1000V |
---|---|---|---|---|---|---|---|
Maximum Size | 2.00” (50.8mm) | 1.00” (25.4mm) | 0.150” (3.81mm) | 120000nF | 60000nF | 25000nF | 8000nF |
Minimum Size | 0.20” (5.08mm) | 0.20” (5.08mm) | 0.050” (1.27mm) | 800nF | 200nF | 70nF | 20nF |
X8R | Length | Width | Thickness | 100V | 250V | 500V | 1000V |
---|---|---|---|---|---|---|---|
Maximum Size | 2.00” (50.8mm) | 1.00” (25.4mm) | 0.150” (3.81mm) | 84000nF | 42000nF | 17500nF | 5600nF |
Minimum Size | 0.20” (5.08mm) | 0.20” (5.08mm) | 0.050” (1.27mm) | 560nF | 140nF | 49nF | 14nF |
- Custom Geometry
- Increased Bulk Capacitance
- High Voltage Capabilities
- Reduction in Size
Table 5: Circular Bulk Capacitance (CapStrate®)
NP0 | Diameter | Thickness | 100V | 250V | 500V | 1000V | 10000V |
---|---|---|---|---|---|---|---|
Maximum Size | 2.00” (50.8mm) | 0.150” (3.81mm) | 7600nF | 3800nF | 2600nF | 1400nF | 940nF |
Minimum Size | 0.20” (5.08mm) | 0.050” (1.27mm) | 25nF | 6nF | 3nF | 1.7nF | 2.8nF |
X7R | Diameter | Thickness | 100V | 250V | 500V | 1000V | 10000V |
---|---|---|---|---|---|---|---|
Maximum Size | 2.00” (50.8mm) | 0.150” (3.81mm) | 180000nF | 95000nF | 40000nF | 12000nF | 8000nF |
Minimum Size | 0.20” (5.08mm) | 0.050” (1.27mm) | 550nF | 140nF | 45nF | 15nF | 20nF |
X8R | Diameter | Thickness | 100V | 250V | 500V | 1000V | 10000V |
---|---|---|---|---|---|---|---|
Maximum Size | 2.00” (50.8mm) | 0.150” (3.81mm) | 126000nF | 66500nF | 28000nF | 8400nF | 5600nF |
Minimum Size | 0.20” (5.08mm) | 0.050” (1.27mm) | 385nF | 98nF | 31.5nF | 10.5nF | 14nF |
Additional sizes and form factors not listed are possible. Contact Johanson to assess the feasibility of your design. Reference table 6 for the maximum capacitance density that can be used for a given substrate. Capacitance density, below, is presented in nF/(mils)3. This is the maximum amount of capacitance available in a given volume.
Table 6: Max Capacitance Density
Rectangular | X7R | NP0 | X8R | Circular | X7R | NP0 | X8R |
---|---|---|---|---|---|---|---|
100V | 4.00E-04 | 1.67E-05 | 2.80E-04 | 100V | 3.82E-04 | 1.61E-02 | 1.13E-02 |
250V | 2.00E-04 | 8.33E-06 | 1.40E-04 | 250V | 2.02E-04 | 8.10E-03 | 5.67E-03 |
500V | 8.33E-05 | 4.67E-06 | 5.83E-05 | 500V | 8.49E-05 | 5.51E-03 | 3.86E-03 |
1000V | 2.67E-05 | 3.13E-06 | 1.87E-05 | 1000V | 2.54E-05 | 2.97E-03 | 2.08E-03 |
Johanson Dielectrics offers a variety of metallization schemes that are high reliability conductors. These metals can be utilized as conductors, solder pads, or methods of thermal transfer. Designers should select the available metal based on the metallization properties that best suit their design. Careful selection of particular metallizations is dependent on requirements for solderability, temperature resistance, and electrical performance.
Table 7: Metallization Schemes Available
Dielectric | Ag / Pt | Ni / Au | Ag / Ni / Au |
---|---|---|---|
X7R | X | X | - |
X8R | X | X | - |
NP0 | X | - | X |
Table 8: Metallization Properties
Material Property | Ag / Pt | Ni / Au | Ag / Ni / Au |
---|---|---|---|
Recommended Thickness | 14µm | 7-12µ” | Contact Factory |
Max Solder Temp | 218°C | 260°C | 230°C |
Table 9: Solder Pad Dimensions
Metallization | Length (Minimum) | Width (Minimum) | Pad Spacing (Minimum) |
---|---|---|---|
Ag/Pt | 0.015" (0.381mm) | 0.010" (0.254mm) | 0.007" (0.178mm) |
Ni/Au | 0.015" (0.381mm) | 0.010" (0.254mm) | 0.007" (0.178mm) |
Ag/Ni/Au | 0.015" (0.381mm) | 0.010" (0.254mm) | 0.007" (0.178mm) |
Table 10: Standard Conductor Traces & Tolerances
Metallization | Line Width / Space (Min) | Line Width / Space Tolerance (Max) | Trace / Metal Thickness |
---|---|---|---|
Ag/Pt | 0.007” (0.178mm) | 0.003”-0.005” (0.076-0.127mm) | 0.014” (0.356mm) |
Ni/Au | 0.007” (0.178mm) | 0.003”-0.005” (0.076-0.127mm) | 0.014” (0.356mm) |
Ag/Ni/Au | Ag/Ni/Au | 0.003”-0.005” (0.076-0.127mm) | 0.014” (0.356mm) |
Vias are used to connect different layers in the CapStrate® as a means of an electrical or thermal connection. Johanson Dielectrics offers plated through-hole vias for designers to use
Table 11: Via Mechanical Dimensions
Via Style | Hole Diameter (Minimum) | Hole to Hole (Minimum Spacing) | Via to Edge (Minimum Spacing) |
---|---|---|---|
Plated Through-hole | 0.028” (0.771mm) | 0.012” (0.305mm) | 0.015” (0.381mm) |
We encourage all designers to submit their drawings or ideas for quick and easy feedback.
To submit:
- Follow Johanson’s design guidelines and standard specifications
- Provide CAD data in multiple layers
- Identify “A” side and “B” side for double-patterned circuits
- Provide tolerances and annotation
- List CapStrate® type, dimensions, and rated voltage
- Specify metallizations, thickness and tolerances, pads
- Specify conductor traces, type, spacing, and tolerances
- List any environmental or electrical testing needed
- Other inspection or acceptance criteria
Don't miss the opportunity to work with our outstanding design engineers.
Send us a message for more information. We look forward to assisting you with your unique design requirements.
Assembly Services
Available in-house
Includes but is not limited to, soldering resistors, inductors, wires and transistors.
One-stop design, manufacturing, and assembly ensures customers receive completed product, without the hassle of developing an assembly stations.